SEEKPCB
Strive To Achieve
Specialized in product & Expertise in type
This area can be fully edited and gives you the opportunity to introduce yourself, your website, your products or your services.
Make PCB Easy
SEEKPCB TECHNOLOGY
SEEKPCB is not only a traditional PCB manufacturer, but also integrates PCB design concepts and PCB assembly experience into it, making PCB manufacturing more reasonable, reliable, and easier to achieve.
Key PCB Concept
- Complex Multilayer PCBOur high-layer PCBs are not only capable of mixing different materials, but also enable reliable and stable metallization of holes at different thicknesses
- Heavy Copper PCB / Thick Copper PCBWe know how to better isolate high-voltage arcs and make thick copper PCBs more reliable and stable
- Ultra-thin PCB with high flatnessWe manufacture ultra-thin PCBs that not only meet the thickness requirements, but also ensure flatness, making the packaging of products smoother
WHY CHOOSE SEEKPCB
01
PCB Expert
PCB manufacturing Intergrated with
PCB Layout & Assembly
02
PCB Protoype and Quick Turn
Expedited PCB manufacturing and No MOQ
03
On Time Delivery & Quality
98% OTD and 0 defect quality target
04
7*24 Hours Professional Service
Professional technical team, efficient communication
Rigid PCB Design Guidline
Below capabilities are ture and achievable,Please be bold to design your PCB.
Rigid PCB Capability | ||||
| Name | limit capability（sample） | Remark | ||
| General | Material | FR4 Normal TG, Mid TG, High TG, Halogen Free, High Speed, High Frequency, PTFE, Polymide |  | |
| Production Type | Complex Multilayer, Ultra Thin, Hybrid Lamination, Heavy Copper, Backplane | |||
| Layer | 1-64 L |  | ||
| Board thickness | Min 0.1mm / Max 10.0mm |  | Ultra thin is one of our outstanding solutions. | |
| Board size | Min. 1*1mm / Max. 1500mm*600mm |  | Outstanding - Extraordinary solutions mean higher costs. Based on the considerations of manufacturability and cost, please design reasonably, unless you have no other way | |
| Copper Thickness | Inner 12 OZ Outer 30 OZ |  | The line width and space will be larger for higher copper thickness, pls consult for detail | |
| Circuit | Min.Line Width & Space | 45um/45um |  | We are capable of MSAP process which means we can have better pattern conformity. |
| Min Ring | Normal: 0.1mm; Best 0.05mm |  | Outstanding - Extraordinary solutions mean higher costs. Based on the considerations of manufacturability and cost, please design reasonably, unless you have no other way | |
| Min BGA pad size | Normal: 0.35mm; Best 0.15mm |  | Outstanding - Extraordinary solutions mean higher costs. Based on the considerations of manufacturability and cost, please design reasonably, unless you have no other way | |
| Via/Hole | Hole Dimension | Min 0.1mm / Max 8 mm. Tol. +/- 0.075mm or +/-0.05mm |  | Outstanding - Extraordinary solutions mean higher costs. Based on the considerations of manufacturability and cost, please design reasonably, unless you have no other way |
| Aspect Ratio (Via Diameter : Board Thickness) | 1:25 | Outstanding - Extraordinary solutions mean higher costs. Based on the considerations of manufacturability and cost, please design reasonably, unless you have no other way | ||
| Max PTH Copper Fill | 0.3mm Via - 0.45 Thickness | Outstanding - Extraordinary solutions mean higher costs. Based on the considerations of manufacturability and cost, please design reasonably, unless you have no other way | ||
| Special Hole Approach | Back Drill, Counterbore, Screw Hole, Cup Hole, Half Hole | |||
| Solder Mask | Solder Mask Thickness | 15-25UM（on copper area） |  | |
| Solder Dam | 2Mil (Green & Blue Mask) |  | ||
| Via Plug | Copper Fill, POFV, Resin Plug, Solder Mask, Copper Bar |  | ||
| Surface Finish | Lead-free Thickness | OSP: 0.2-0.3UM Lead-Free HASL: 1-40UM ENIG(Immersion Gold): Ni 3-5UM; Au 0.025-0.1UM Immersion Tin: ≥1.0UM Immersion Sliver: 0.1-0.3UM ENIG+OSP: Refer to OSP & ENIG Gold Finger: Same As Hard Gold ENEPIG: Ni 3-5UM; Pd 0.05-0.1UM; Au 0.025-0.1UM Outstanding： Electroplated Hard Gold: Ni 3-5UM; Au 0.025-2.5UM Soft Gold: Ni 3-5UM; Au 0.025-0.3UM Electroplated Tin: 3-8UM Electroplated Silver: Ni 3-5UM; Ag 1UM |  | |
| Leaded | Lead HASL : Same As LF HASL | |||
| Carbon Ink Thickness | 0.1-0.35UM |  | ||
| Peelable Soldermask Thickness | 0.2-0.5MM |  | ||
| Others | Impedance tolerance | Normal: +/-10% Vs Best: +/-5% | Outstanding - Extraordinary solutions mean higher costs. Based on the considerations of manufacturability and cost, please design reasonably, unless you have no other way | |
| Outline Tolerance | Normal: +/-0.013mm Vs Best: +/-0.05mm |  | ||
| Warpage | Normal:0.75% Vs Best: 0.5% |  | ||
