SEEKPCB is one of the ic substrate manufacturers being involved in IC substrates since 2018, from the initial LED substrates, to fingerprint substrates, Memory storage substrates and RF substrates, SEEKPCB continues to improve the manufacturing process of packaging substrates, MSAP with minimum line 15um, Laser minimum through hole 0.05mm, coreless ultra-thin substrate, ETS high-consistency line embedded substrate, leadless gold plating NPL, our products cover LGA, BGA, CSP substrate, and strive to work towards Flip Chip substrate.
IC substrate prototype quick turn is a unique service of SEEKPCB, we have a quick turn IC substrate service team and mature process, can provide customers with fast IC substrate delivery services.
IC substrate is often referred to as BT substrate because the main material of IC substrate is called BT （Bismaleimide Triazine）.
SEEKPCB has a large number of Mitsubishi BT materials and Taiyo substrate solder mask, which can meet the product needs of most customers, at the same time greatly reduce the waiting time for material.
From a technical point of view and material reserves, SEEKPCB is the best choice for your IC substrate development and marketization.