FR4(TG150,170, Halogen Free), High Speed, High Frequency, BT
|Structure||1)1+N+1 : 1+4+1 thinkness （min）0.35mm |
2)2+N+2: 2+4+2 thinkness （min）0.52mm
3)3+N+3: 3+4+3 thinkness （min）0.70mm
4)4+N+4: 4+4+4 thinkness （min）0.87mm
|Copper Thickness||HOZ - 12OZ|
|Total Thickness||0.2 - 6.8 mm|
|Insulating layer thickness||0.03mm|
|Max. board Dimension||685.8*914.4mm|
|Min Hole Diameter||0.05mm Laser Via, 0.1mm Mechanical Via|
|Min. line width/spacing||45um/45um|
|Min BGA Dimension||0.15mm|
|Special Hole||Blind Hole, Blind Slot, T-Hole, T-Slot, Counter Sink Hole, Cup Hole|
|Surface treatment||OSP, ENIG,Plating Silver, ENEPIG, Immersion Silver, Immersion Tin|
|Outline||Tooling Punching, CNC Routing +/-0.075mm, V-CUT, Laser Routing +/-0.05mm|
HDI (High-Density Interconnect) PCB is a type of printed circuit board that has a higher density of components and interconnections than traditional PCBs. It is designed to provide a more compact, lightweight, and high-performance solution for electronic devices, particularly those that require miniaturization, high speed, and reliability.
HDI PCBs feature microvias, blind vias, and buried vias, which are smaller in diameter and have higher aspect ratios than traditional vias. This allows for a higher density of interconnections and components, reducing the board size and weight, and increasing the signal integrity and speed.
HDI PCBs are used in a wide range of applications, including mobile devices, computer hardware, automotive electronics, medical devices, and more. They offer a number of advantages over traditional PCBs, including improved electrical performance, thermal management, and signal integrity, as well as reduced size, weight, and cost.